CPU Cooling in Data Center Using a Thermosiphon Loop with Tapered Open Microchannel Manifold (OMM)
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Review of Literature and a Preliminary Experimental Investigation on Start-up Instabilities in an R-11 Thermosiphon Loop with Applications in Microelectronic Chip Cooling
A literature review on the recent applications and developments of thermosiphon loop is conducted. In particular, systems suitable for cooling of microelectronic chips are reviewed in greater detail. The advantages of using a thermosiphon loop in microelectronic applications are discussed. The instability and temperature overshoot at the start-up have been identified as major problems which req...
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